Micron
HBM 3D Power Delivery Network (PDN) Engineer
$146K–$297K
Richardson, TX +1 · Full-time · Posted Jun 22, 2026
- Location
- Richardson, TX
Folsom, CA - Experience
- Minimum 10 years of experience in a related field.
- Education
- Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field.
About the job
Designs, analyzes, and optimizes power delivery networks for next-generation HBM products, ensuring power integrity, reliability, and manufacturability across die, package, and system domains.
What you'll do
- Design HBM and SoC power delivery networks and optimize power integrity through EM/IR analysis, signoff, and reliability verification.
- Collaborate with architecture, physical design, packaging, and system teams on implementation and die-package-system PDN optimization.
- Debug PDN issues across pre-silicon and post-silicon phases and improve methodologies through automation and scripting.
What they ask for
- Strong experience in PDN design and analysis for complex SoCs or high-performance ASICs.
- Proficiency with EM/IR tools such as RedHawk, Totem, or equivalent, and Spice-based simulation tools and 3D PDN modeling.
- Understanding of IR drop, electromigration, dynamic voltage droop, and power noise mechanisms.
- Experience with physical design flows and familiarity with the RTL-to-GDSII flow and signoff methodologies.
Nice to have
- Experience with HBM, DRAM, memory-centric SoCs, or 3DIC power delivery.
- Familiarity with die-package-system co-design, advanced packaging, transient/vector-based power analysis, or JEDEC standards.
Pay
$146,000.00 - $297,000.00 USD a year (base salary)
Tools
Cadence RedHawk, Ansys Totem, RedHawk, Totem, Spice
Model-written summary · the original posting is authoritative