Micron
HBM SIPI, Senior Engineer
Richardson, TX · Senior · Full-time · Posted Oct 19, 2026
- Experience
- 5 years minimum; 7+ years preferred.
About the job
Develop SI/PI analysis and sign-off for HBM interposers, packages, and silicon channels across multiple product generations.
What you'll do
- Analyze signal integrity in 2.5D/3D interposer channels using frequency- and time-domain methods, including mask-based timing analysis.
- Support power integrity and PDN analysis, including impedance modeling and transient response.
- Model and extract electromagnetic properties of signal and power delivery channels; automate sign-off processes and work with EDA suppliers to improve tools and flows.
What they ask for
- At least 5 years of experience in SI and PI modeling and analysis.
- Deep understanding of SI/PI, electromagnetic and transmission line theory, and I/O design.
- Circuit simulation experience, such as Keysight ADS and Synopsys HSPICE.
- Use AI/ML/LLM for productivity or efficiency.
Nice to have
- 7+ years of SI and PDN modeling and analysis; experience with SI/PI for 2.5D/3D advanced packaging.
- Experience with high-speed interfaces and EDA tools including ANSYS HFSS/SIwave, Keysight ADS, Synopsys HSPICE, and Cadence PowerSI/PowerDC.
Tools
SPICE, ADS, Keysight ADS, Synopsys HSPICE, ANSYS HFSS/SIwave, Cadence PowerSI/PowerDC, CoWoS, EMIB
AI focus
Use AI/ML/LLM for productivity or efficiency; support design and deployment of AI-enabled solutions that improve efficiency and decision-making.
Model-written summary · the original posting is authoritative