Micron
Intern - DRAM PI
Boise, ID - Main Site · Internship · Posted Aug 16, 2026
- Experience
- No minimum number of years stated.
- Education
- Currently pursuing a Master of Science degree in Electrical Engineering, Microelectronics, or a related field; anticipated graduation after September 2027.
About the job
Supports development of next-generation DRAM technologies by coordinating process integration work, resolving technical challenges, and collaborating across engineering teams.
What you'll do
- Define technology landmarks, design rules, and structural, electrical, and integration requirements for next-generation DRAM products.
- Coordinate module-related integration activities, identify risks, develop test plans, and communicate progress and recommendations.
- Evaluate alternative architectures, process enablers, and scaling solutions; use AI-assisted tools and data-driven methods to improve engineering work.
What they ask for
- Currently pursuing an MS in Electrical Engineering, Microelectronics, or a related field, with expected graduation after September 2027.
- Demonstrated knowledge of DRAM process integration, device physics, semiconductor scaling, and advanced memory technologies.
- Experience with Design of Experiments (DOE), statistical analysis, and interpretation of complex engineering data.
- Experience using AI tools for technical problem-solving, data analysis, research, or engineering workflows.
Nice to have
- Currently pursuing or planning to pursue a PhD in a relevant technical field.
- Experience with technical leadership, project coordination, or mentoring; familiarity with advanced DRAM architectures and emerging memory trends.
Tools
DRAM, Design of Experiments (DOE), AI
AI focus
Use AI tools and data-driven methods to support engineering productivity, analysis, decision-making, and technical problem-solving.
Model-written summary · the original posting is authoritative