Micron
Intern - DRAM Process Integration
Boise, ID - Main Site · Internship · Posted Aug 31, 2026
- Education
- Currently pursuing a Master of Science degree in Electrical Engineering, Microelectronics, or a related technical field; expected graduation date of September 2027 or later.
About the job
Contribute to developing next-generation DRAM technologies by coordinating process integration, device, materials, and architecture work across engineering teams.
What you'll do
- Define technology targets, design rules, structural requirements, and electrical specifications for DRAM technologies.
- Coordinate with engineering teams and maintain plans, risk, issue-resolution, and characterization documentation.
- Evaluate device architectures, process enablers, and scaling approaches; use approved AI tools to support analysis and decisions.
What they ask for
- Currently pursuing an MS in Electrical Engineering, Microelectronics, or a related technical field, with expected graduation September 2027 or later.
- Knowledge of semiconductor process integration, device physics, and technology scaling.
- Experience with Design of Experiments (DOE), statistical analysis, and data-driven problem-solving.
- Ability to resolve complex technical challenges and communicate technical information effectively.
Nice to have
- Currently pursuing or enrolled in a PhD program in a related technical field.
- Experience with AI or machine learning for technical research, engineering analysis, productivity, or semiconductor process development.
Tools
DRAM, Design of Experiments (DOE), Artificial Intelligence (AI), Generative AI, machine learning
AI focus
Use approved AI and AI-assisted tools for technical analysis, data interpretation, productivity, and engineering decisions; AI and machine learning experience for engineering analysis or semiconductor process development is preferred.
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