Micron
Intern - Engineer, HIG HBM DTPCO
Richardson, TX · Internship · Posted Oct 5, 2026
- Experience
- 3+ years; no alternatives stated.
- Education
- Bachelor's degree in Electrical Engineering, Computer Engineering, Materials Science, Physics, or a related technical field.
About the job
Characterize HBM devices under thermal, mechanical, and electrical stress, analyze silicon data, and develop tests and models to improve performance, yield, reliability, and future designs.
What you'll do
- Design, debug, and complete bench-level test setups and measurement flows for HBM devices.
- Run stress characterization and analyze electrical, thermal, mechanical, and MBIST data to investigate root causes and recommend corrective actions.
- Develop test programs, workloads, and analysis workflows using programming languages and AI tools.
What they ask for
- Bachelor's degree in Electrical Engineering, Computer Engineering, Materials Science, Physics, or a related technical field.
- 3+ years of experience in semiconductor characterization, failure analysis, product engineering, test engineering, or a related field.
- Hands-on experience with laboratory equipment such as oscilloscopes, SMUs, power supplies, thermal systems, probe stations, or automated test hardware.
- Programming experience in Python and at least one additional language such as C/C++ or Verilog; experience analyzing complex datasets and conducting root-cause investigations.
Nice to have
- Master's or PhD in a related field; experience with DRAM, HBM, memory subsystems, advanced packaging, or silicon characterization.
- Knowledge of reliability, yield, DOE, MBIST, semiconductor test methods, or AI-enabled tools.
Tools
Python, Verilog, C/C++, SMUs, oscilloscopes, power supplies, thermal systems, MBIST
AI focus
Use AI, Agentic AI, and Generative AI tools to improve engineering workflows, data analysis, test development efficiency, and problem-solving.
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