Drimva

Micron

Intern - HBM Data Scientist

Richardson, TX · Internship · Posted Oct 27, 2026

Experience
0–2 years of relevant experience through coursework, research, internships, academic projects, hackathons, or data science competitions.
Education
Currently pursuing a Bachelor's degree in Data Science, Statistics, Mathematics, Computer Science, Electrical Engineering, Computer Engineering, or a related quantitative field; expected graduation between December 2027 and June 2028.

About the job

Applies data science and AI methods to semiconductor manufacturing data to uncover patterns and develop tools that support engineering decisions.

What you'll do

  • Analyze manufacturing data using statistical and machine learning methods to identify trends and anomalies.
  • Develop and evaluate AI agents and LLM-enabled workflows, including prompt design and performance assessment.
  • Prepare data and build reproducible analytics, visualizations, dashboards, and reports; communicate findings to engineering partners.

What they ask for

  • Currently pursuing a Bachelor's degree in a listed or related quantitative field, with expected graduation between December 2027 and June 2028.
  • Python experience for data analysis and basic SQL experience.
  • Knowledge of statistics and machine learning fundamentals, including hypothesis testing, regression, clustering, and PCA.
  • Experience with AI technologies, LLMs, AI agents, or generative AI platforms.

Nice to have

  • Experience with time-series analysis, forecasting, anomaly detection, change-point detection, or statistical modeling.
  • Familiarity with LLM agents, RAG, MCP, LangGraph, prompt engineering, or AI workflow orchestration frameworks.

Tools

Python, Pandas, NumPy, SQL, LLMs, RAG, MCP, LangGraph

AI focus

Develops and evaluates AI agents and LLM-enabled workflows for semiconductor manufacturing, including prompt design and model performance assessment.

Model-written summary · the original posting is authoritative

First seen Oct 28, 2026 · Last verified Nov 5, 2026 (UTC)