Micron
Intern - Next Gen HBM Platform Arch
Folsom, CA · Internship · Posted Oct 5, 2026
- Experience
- 0–2 years of relevant experience through internships, research projects, coursework, or academic projects.
- Education
- Currently pursuing a Bachelor's, Master's, or PhD degree in a specified or related field.
About the job
Evaluates electrical, thermal, and power-delivery architectures for next-generation HBM platforms, developing analysis and modeling tools to improve memory-system performance, efficiency, reliability, and scalability.
What you'll do
- Analyze signaling, timing, thermal performance, and power delivery across HBM architectures and system topologies.
- Develop modeling, simulation, and automation tools for architecture evaluation.
- Collaborate with architecture, design, packaging, and technology teams on system-level trade-offs.
What they ask for
- Currently pursuing a Bachelor's, Master's, or PhD in Electrical Engineering, Electronics Engineering, Computer Engineering, Computer Science, or a related field.
- Coursework or project experience in areas such as analog or I/O design, signaling, DRAM, high-speed interfaces, packaging, or 2.5D/3D integration.
- Understanding of electrical systems, signal integrity, power delivery, circuit analysis, or semiconductor design fundamentals.
- Experience using AI-enabled tools or LLMs in engineering workflows and ability to critically evaluate their outputs.
Nice to have
- Familiarity with Cadence EDA tools, MATLAB, thermal analysis tools, signal integrity tools, or related software.
- Experience with semiconductor packaging, HBM/DRAM, thermal or power-delivery analysis, or engineering automation using Python or similar languages.
Pay
$50.24 - $50.24 an hour (USD, base salary)
Tools
Cadence EDA tools, MATLAB, Python, Copilot, Claude, ChatGPT
AI focus
Use AI-enabled tools and LLMs in engineering workflows, critically validating and evaluating their outputs.
Model-written summary · the original posting is authoritative