Micron
Intern - Process Development Engineer, 3D DRAM Dry Etch
Boise, ID - Main Site · Internship · Posted Aug 4, 2026
- Education
- Currently pursuing an M.S. or Ph.D. in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, or a related technical field; must remain enrolled throughout the internship.
About the job
Develop and optimize advanced dry etch processes for future DRAM technologies through experimentation, data analysis, and collaboration with engineering teams.
What you'll do
- Research and develop solutions for next-generation memory technologies and dry etch processes.
- Design and analyze experiments and manufacturing data to improve performance, quality, and process understanding.
- Collaborate across engineering teams and use AI-enabled analysis, data-driven methods, or programming to improve engineering work.
What they ask for
- Currently pursuing an M.S. or Ph.D. in a listed technical field or related field, and enrolled throughout the internship.
- Knowledge of semiconductor dry etch processing, plasma physics, or related fabrication technologies.
- Experience with experimental design, data analysis, statistical methods, or engineering research projects.
- Strong analytical, problem-solving, written, and verbal communication skills.
Nice to have
- Experience with semiconductor process development, characterization, or advanced manufacturing.
- Programming, data analytics, AI, or familiarity with tools such as Python, MATLAB, or JMP.
Tools
Python, MATLAB, JMP
AI focus
Apply AI-enabled analysis tools, data-driven methods, or programming to improve engineering efficiency and technical decision-making; preferred experience includes leveraging AI for engineering analysis and workflow optimization.
Model-written summary · the original posting is authoritative