Micron
Intern - Process Integration – Advanced Packaging
Boise, ID - Main Site · Internship · Posted Oct 31, 2026
- Education
- Currently enrolled in an accredited university; expected graduation no earlier than Fall 2026.
About the job
Supports development of advanced packaging and interconnect processes through experiments, monitoring, data analysis, and yield improvement.
What you'll do
- Use structured problem-solving and design of experiments to support process development.
- Monitor production lines, develop monitoring methods and metrics, and contribute to yield improvement.
- Conduct experiments, analyze results, document findings, and communicate recommendations to teams and partners.
What they ask for
- Currently enrolled in an accredited university, with expected graduation no earlier than Fall 2026.
- Excellent data extraction, analysis, and reporting skills.
- Strong collaboration and communication skills across multifunctional teams.
- Ability to prioritize complex tasks, adapt, and work under tight timelines and limited resources.
Nice to have
- Experience with semiconductor process integration or packaging technologies.
- Familiarity with structured problem-solving, experimental design, or statistical analysis tools.
Tools
JMP, Kepner-Tregoe (KT), Design of Experiments (DoE)
AI focus
Use AI tools, workflows, and agents to maximize learning.
Model-written summary · the original posting is authoritative