Drimva

Micron

Intern - Wet Etch Process Development Engineer

Boise, ID - Main Site · Internship · Posted Aug 17, 2026

Education
Currently pursuing an M.S. or Ph.D. in Chemical Engineering, Chemistry, Materials Science, or a related field; graduation date after December 31, 2027.

About the job

Develops and evaluates wet-processing solutions and chemistries for future semiconductor technologies and improvements to existing manufacturing processes.

What you'll do

  • Develop, execute, and evaluate wet-process experiments; support chemistry development, contamination reduction, and surface/interface characterization.
  • Analyze experimental data and communicate findings in reports, presentations, and project updates.
  • Collaborate with engineering teams and use AI-enabled and data-driven methods to improve process optimization and analysis workflows.

What they ask for

  • Currently pursuing an M.S. or Ph.D. in Chemical Engineering, Chemistry, Materials Science, or a related field, with graduation after December 31, 2027.
  • Prior academic experience in wet processing, chemistry research, or related laboratory environments.
  • Demonstrated verbal and written communication skills, including preparing technical reports and presentations.
  • Ability to work independently, manage priorities and timelines, and collaborate in individual and team settings.

Nice to have

  • Background in organic, inorganic, or surface chemistry, electrochemistry, or materials science; knowledge of integrated circuit processing, semiconductor devices, or manufacturing.
  • Experience with statistical data analysis, experimental design, or characterization; familiarity with AI, Generative AI, LLMs, AI Assistant tools, or Agentic AI.

Tools

Artificial Intelligence (AI), Generative AI, Large Language Models (LLMs), AI Assistant tools, Agentic AI, Agentic Solutions

AI focus

Apply AI and data-driven methods to improve research efficiency, process optimization, data analysis, workflows, and documentation.

Model-written summary · the original posting is authoritative

First seen Oct 15, 2026 · Last verified Nov 4, 2026 (UTC)