Micron
Mechanical/Thermal Principal Design Engineer
Boise, ID - Main Site · Principal · Full-time · Posted Oct 14, 2026
- Experience
- 7+ years of mechanical and thermal engineering experience, including 7+ years in the electronics, storage, or semiconductor industry.
- Education
- Bachelor’s or Master’s degree or equivalent experience in Mechanical Engineering.
About the job
Leads the design, analysis, validation, and release of mechanical and thermal solutions for advanced electronic systems and memory products.
What you'll do
- Develop cooling solutions and define mechanical, thermal, reliability, and manufacturability requirements.
- Lead CFD and FEA analyses, validation, testing, risk reviews, and root-cause investigations across the product lifecycle.
- Collaborate across engineering and manufacturing teams, mentor engineers, and champion AI-enabled engineering workflows.
What they ask for
- Bachelor’s or Master’s degree or equivalent experience in Mechanical Engineering.
- 7+ years of mechanical and thermal engineering experience, including 7+ years in the electronics, storage, or semiconductor industry.
- Expertise in SolidWorks, thermal modeling, and CFD simulation tools such as ANSYS Icepak, Fluent, or similar platforms.
- Hands-on experience with thermal management technologies, testing, validation, and failure analysis; deep understanding of mechanical design, heat transfer, fluid dynamics, GD&T, tolerance analysis, and DFM/DFA.
Nice to have
- Experience with DDR, LPDDR, PCIe, HBM, memory modules, storage subsystems, or AI accelerator platforms.
- Understanding of JEDEC standards and data center/server hardware architectures, or advanced cooling for AI/HPC.
Tools
SolidWorks, ANSYS Icepak, Fluent, CFD, FEA, DDR, LPDDR, PCIe
AI focus
Champion AI-enabled workflows for engineering simulation, design optimization, validation, and productivity; role also involves AI computing platforms.
Model-written summary · the original posting is authoritative