Micron
MTS Package engineer - ASIC package design, logic integration and design rules
$143K–$398K
Boise, ID - Main Site +1 · Full-time · Posted Oct 28, 2026
- Location
- Boise, ID - Main Site
San Jose, CA - Experience
- 10+ years.
- Education
- Bachelor’s degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or a related field.
About the job
Designs and integrates ASIC and memory package architectures, defining connectivity and design rules while supporting verification, bring-up, and reliability debugging.
What you'll do
- Define package architecture, connectivity, and electrical requirements; develop diagrams, schematics, and netlists.
- Support ASIC/package co-design, protocol enablement, physical and electrical implementation, and design-rule roadmaps.
- Lead technical reviews and help resolve integration, connectivity, and reliability issues through cross-functional collaboration.
What they ask for
- Bachelor’s degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or a related field.
- 10+ years of experience.
- Hardware design and development experience, including block diagrams, schematics, and electrical requirements.
- Experience with ASIC architecture in storage products and high-speed serial and parallel interfaces.
Nice to have
- Semiconductor package design, architecture, or integration experience; familiarity with advanced packaging and assembly.
- Experience and/or interest in developing Agentic AI workflows.
Pay
$143,000.00 - $398,000.00 a year USD base salary
Tools
Cadence Allegro System Capture, Synopsys Design Compiler, Mentor Graphics PADS, Altium Designer, OrCAD, PCIe, MIPI, DDR, LPDDR, ONFI
AI focus
Experience and/or interest in developing Agentic AI workflows into current or future processes.
Model-written summary · the original posting is authoritative