Micron
MTS Process Integration Engineer | APTD Die Level Technology
Boise, ID - Main Site · Full-time · Posted Sep 24, 2026
- Experience
- 8+ years; no alternative stated.
- Education
- Bachelor’s degree in Materials Engineering, Chemical Engineering, or a related field.
About the job
Develops and integrates advanced packaging technologies, improves process performance and yield, and transfers new package architectures into manufacturing.
What you'll do
- Develop and optimize 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnect technologies; design and execute qualification experiments.
- Analyze yield, performance, and defect data to identify improvements, and predict and mitigate wafer/die warpage using modeling and metrology.
- Drive technology transfer and manufacturing readiness in collaboration with cross-functional engineering teams.
What they ask for
- Bachelor’s degree in Materials Engineering, Chemical Engineering, or a related field, with 8+ years of experience in advanced packaging development, 2.5D, 3D stacking, and HBM integration.
- Experience with TSVs, advanced interconnects, die stacking, underfill, molding, bonding, and package integration processes.
- Experience with hybrid bonding integration and reliability, including wafer-to-wafer or chip-to-wafer processes.
- Experience with HBM and logic integration, including thermal optimization, and supporting cross-functional engineering programs.
Nice to have
- Master’s degree or PhD in Materials Engineering, Chemical Engineering, or a related field.
- Experience with thermocompression bonding, microbump, or interposer-based packaging; data analytics, automation, or AI-enabled workflows; or technical papers, patents, or engineering documentation.
Tools
2.5D, 3D stacking, HBM, hybrid bonding, TSVs, SPC, advanced analytics, inline metrology
AI focus
Preferred experience includes using AI-enabled workflows to improve engineering efficiency.
Model-written summary · the original posting is authoritative