Micron
MTS - Thermal Simulation Engineer
Richardson, TX · Full-time · Posted Oct 15, 2026
- Experience
- PhD plus 5 years of industry experience, or Master’s degree plus 10 years of industry experience.
- Education
- PhD or Master’s degree in Mechanical Engineering, Materials Science, Physics, or a related field.
About the job
Provides technical leadership in thermal and thermo-mechanical simulation for next-generation HBM packages, guiding design decisions and validating models against silicon measurements.
What you'll do
- Develop multiphysics models and simulation strategies for HBM packages and advanced packaging systems.
- Lead simulation-to-silicon correlation and translate results into product, package, material, and process guidance.
- Advance simulation methods and automation, evaluate AI-enabled engineering workflows, and mentor engineers.
What they ask for
- Extensive industry experience in thermal simulation or multiphysics modeling for semiconductor devices, advanced packaging, or related technologies.
- Strong foundation in heat transfer, thermodynamics, and solid mechanics.
- Hands-on experience with multiphysics simulation tools and advanced FEM, coupled thermal-structural simulation, and model calibration.
- Expertise modeling thermo-mechanical phenomena including thermal resistance, heat spreading, stress, warpage, and material interactions.
Nice to have
- Understanding of HBM, 2.5D/3D integration, TSVs, hybrid bonding, or interposers; material characterization and experimental validation.
- Exposure to CFD or flow-based simulation; scripting or data analysis with Python, MATLAB, or JMP.
Tools
Ansys, Abaqus, Fluent, Star-CCM+, FloTHERM, FEM, Python, MATLAB
AI focus
Lead evaluation and responsible adoption of AI-enabled engineering workflows to improve productivity, innovation, quality, and execution speed.
Model-written summary · the original posting is authoritative