Micron
New College Grad - HBM PYE Product Development Failure Analysis Enginee
Boise, ID - Main Site · Entry level · Full-time · Posted Oct 29, 2026
- Education
- Bachelor's degree in Electrical Engineering, Computer Engineering, Physics, Materials Science, or a related technical field, or equivalent experience.
About the job
Analyzes failures in new High Bandwidth Memory (HBM) products and drives solutions to improve yield, reliability, and production ramp.
What you'll do
- Perform electrical, physical, and statistical failure analysis to identify component failure mechanisms and root causes.
- Collaborate with Product, Process, Quality, and Test Engineering teams to resolve yield, reliability, and process issues.
- Use AI-enabled tools and statistical methods to analyze data, identify trends, and communicate corrective actions and risks.
What they ask for
- Bachelor's degree in Electrical Engineering, Computer Engineering, Physics, Materials Science, or a related technical field, or equivalent experience.
- Experience or coursework in semiconductor device physics, manufacturing processes, or VLSI design.
- Knowledge of statistical analysis and data-driven problem solving.
- Experience using Python or similar programming languages for data analysis and engineering applications.
Nice to have
- Master's degree in a related field.
- Experience in semiconductor failure analysis, yield enhancement, reliability engineering, product characterization, AI-assisted analysis, or advanced memory technologies.
Tools
Python, AI-enabled tools
AI focus
Uses AI-enabled tools for engineering data analysis and failure investigations; preferred experience includes AI, Generative AI, or AI-assisted analytical tools.
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