Micron
New College Grad - Product Yield Enhancement Engineer, HBM
Boise, ID - Main Site · Full-time · Posted Sep 30, 2026
- Experience
- 0-2 years of semiconductor industry experience in yield engineering, fault isolation, or failure analysis.
- Education
- Bachelor’s or Master's degree in Electrical Engineering, Materials Science, Computer Engineering, Physics, Chemistry, or equivalent practical experience.
About the job
Analyze HBM product failures from production tests, qualifications, and customer returns to identify root causes, improve reliability, and support production ramp and time-to-market.
What you'll do
- Perform electrical and physical failure analysis, fault isolation, and defect de-processing.
- Analyze failure data and signatures, and report root causes and corrective-action insights.
- Collaborate across teams to resolve issues and use AI-assisted workflows to find failure patterns.
What they ask for
- Bachelor’s or Master's degree in a listed engineering or science field, or equivalent practical experience.
- 0-2 years of semiconductor industry experience in yield engineering, fault isolation, or failure analysis.
- Experience with CAD, including layout and schematic analysis; understanding of semiconductor device physics and VLSI design principles.
- Proficiency in scripting in UNIX/Linux environments, such as Tcl, Bash, or Shell.
Nice to have
- Hands-on experience with fault isolation and failure analysis techniques.
- Knowledge of semiconductor packaging, assembly, fabrication workflows, reliability engineering, or AI-assisted analytics.
Tools
CAD, UNIX/Linux, Tcl, Bash, Shell, CMOS/FinFET, EOTPR
AI focus
Use AI-assisted tools and workflows to analyze large datasets, identify failure patterns, and accelerate root-cause determination.
Model-written summary · the original posting is authoritative