Micron
Photonics Integration Engineer, MTS
$131K–$241K
Boise, ID - Main Site · Full-time · Posted Nov 2, 2026
- Experience
- Over 3 years with a PhD or comparable experience; more than 5 years with a Master's degree or comparable experience; upwards of 7 years with a Bachelor's degree or equivalent experience.
- Education
- PhD in Electrical Engineering, Materials Science, Physics, Photonics, Semiconductor Engineering, or related field, or equivalent experience; alternatively, Master's degree or comparable experience, or Bachelor's degree or equivalent experience.
About the job
Leads silicon photonics and heterogeneous integration process development from concept through manufacturing readiness for high-performance optical connectivity.
What you'll do
- Develop and optimize end-to-end silicon photonics process integration flows and lead device, optical interconnect, and advanced packaging integration.
- Drive process characterization, DOE, yield improvement, defect reduction, root-cause investigations, and process optimization.
- Lead technical programs and roadmaps, collaborate across engineering and supplier teams, and advance AI-enabled engineering initiatives.
What they ask for
- Experience integrating silicon photonics processes in semiconductor development or manufacturing.
- Knowledge of semiconductor process integration, wafer fabrication, process characterization, DOE methodology, and statistical analysis.
- Experience with process flow architecture, device integration, design rule development, and tapeout execution.
- Demonstrated leadership of cross-functional technical projects and data-driven engineering problem-solving.
Nice to have
- Experience with silicon photonics, III-V semiconductor technologies, heterogeneous integration, and advanced packaging.
- Knowledge of optical interconnect applications or experience applying AI, machine learning, analytics, or workflow automation to engineering or manufacturing.
Pay
$131,000.00 - $241,000.00 a year USD base salary
Tools
silicon photonics, III-V semiconductor technologies, hybrid bonding, wafer bonding, optical interposers, co-packaged optics, AI, machine learning
AI focus
Leads AI-enabled engineering initiatives and may apply AI, machine learning, advanced analytics, or workflow automation to engineering and manufacturing challenges.
Model-written summary · the original posting is authoritative