Micron
Principal Design Engineer, HBM Architecture
Richardson, TX · Principal · Full-time · Posted Oct 28, 2026
- Experience
- 7+ years with a bachelor’s degree, or 5+ years with a master’s degree; also requires 3+ years in high-speed digital datapath design and 2+ years of hands-on implementation experience.
- Education
- Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related field, or a Master’s degree.
About the job
Architects and optimizes high-speed HBM read and write datapaths across core and logic dies, from design through silicon bring-up and production.
What you'll do
- Design and optimize datapath circuits for bandwidth, power, area, reliability, and timing.
- Integrate reliability features such as parity, ECC hooks, lane redundancy, and remapping.
- Coordinate with PHY, DFT, verification, layout, and system teams on implementation, testability, and manufacturability.
What they ask for
- Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related field with 7+ years of relevant industry experience, or a Master’s degree with 5+ years of relevant industry experience.
- 3+ years of experience in high-speed digital datapath design (memory, SerDes, or SoC datapath).
- 2+ years of hands-on experience with digital schematic build, RTL, or mixed-signal datapath implementations.
Nice to have
- Understanding of HBM/DRAM architectures and high-speed datapath layout and floorplanning.
- Experience with static timing analysis (STA), timing closure, and advanced process-node challenges.
Tools
HBM, DRAM, SerDes, SoC, RTL, STA, ECC, DFT
AI focus
Use AI tools to efficiently carry out regular work.
Model-written summary · the original posting is authoritative