Micron
Principal Engineer, APTD
Boise, ID - Main Site · Principal · Full-time · Posted Aug 28, 2026
- Experience
- Over 10 years of professional experience in semiconductor advanced packaging.
- Education
- BS, MS, or Ph.D. in Material Science, Electrical, Chemical, or Mechanical Engineering, Physics, or related field, or equivalent experience.
About the job
Leads advanced packaging technology strategy, roadmaps, and investment decisions, using technical expertise and cost analysis to develop production-ready solutions and strengthen Micron’s competitive position.
What you'll do
- Identify and drive packaging technology innovations that deliver business value; guide technology roadmaps and investment priorities.
- Collaborate with partners and influence senior technical and strategic decisions; analyze competitive trends and metrics.
- Define requirements using technical data and advance innovations through patents, trade secrets, presentations, and papers.
What they ask for
- Deep knowledge of High Bandwidth Memory, 2.5D integration, and emerging 3D integration strategies, including Hybrid bonding.
- Hands-on process module engineering experience in Wafer Level Packaging or 3D stacking process.
- Experience in DRAM manufacturing and OSAT companies.
Nice to have
- Understanding of DRAM wafer structure and process flows.
- Additional language skills in East Asian languages; patent inventions or published literature.
Tools
High Bandwidth Memory, 2.5D integration, 3D integration, Hybrid bonding, Wafer Level Packaging, DRAM, OSAT
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