Micron
Principal Engineer - HIG HBM - ARCHITECTURE
Richardson, TX · Principal · Full-time · Posted Sep 15, 2026
- Experience
- 7+ years in semiconductor design, architecture, or technology development.
- Education
- MS or PhD in Electrical Engineering or a related field.
About the job
Defines HBM PHY and high-speed analog/mixed-signal IO architecture, calibration, and timing methods, guiding development from architectural concepts through silicon.
What you'll do
- Define HBM PHY and IO architecture, balancing performance, power, area, reliability, and manufacturability.
- Architect transmit/receive paths and optimize calibration, timing budgets, and margin methodologies.
- Collaborate across engineering teams, influence HBM roadmap decisions, and mentor design teams.
What they ask for
- MS or PhD in Electrical Engineering or a related field.
- 7+ years of experience in semiconductor design, architecture, or technology development.
- Expertise in analog and mixed-signal IO design and architecture.
- Deep knowledge of high-speed transmitter, receiver, clocking, and timing architectures.
Nice to have
- Experience with HBM, DDR, UCIe, PCIe, or other high-speed memory and interconnect technologies.
- Experience with AI-enabled analytics or automation for design quality, silicon analysis, or engineering productivity.
Tools
HBM, DDR, UCIe, PCIe, 2.5D, 3D integration, TSV, PLLs
AI focus
Preferred experience using AI-enabled analytics or automation to improve design quality, silicon analysis, or engineering productivity.
Model-written summary · the original posting is authoritative