Micron
Principal Engineer, HIG-HBM Design
Richardson, TX · Principal · Full-time · Posted Oct 7, 2026
- Experience
- 10 years of experience in the job offered or in a related field.
- Education
- Master’s degree in Electrical Engineering, Physics, Computer Engineering, Semiconductor Engineering or a related field.
About the job
Designs and validates HBM memory circuits and processes, collaborating across teams to improve performance, power, cost, quality, reliability, and time-to-market.
What you'll do
- Craft, simulate, optimize, and floor plan digital and analog DRAM circuits.
- Collaborate with design, verification, product engineering, test, process integration, assembly, and marketing teams to develop HBM products.
- Develop, debug, and qualify front-end and backend processes for low-power-per-bit solutions supporting ML and AI applications.
What they ask for
- High-speed memory design on data paths from I/O interface to core array.
- Power domain network analysis; memory test architectures such as MBIST and production silicon validation.
- Digital design methodologies, including RTL design, synthesis, and physical implementation; ASIC design development using digital design.
- Memory core timing, latency control, and signal integrity in advanced designs.
Tools
DRAM, HBM, MBIST, RTL
AI focus
Develops low-power-per-bit memory solutions for ML (Machine Learning) and AI (Artificial Intelligence) applications.
Model-written summary · the original posting is authoritative