Micron
Principal Foundry Interface Design Engineer, HBM
$150K–$308K
Folsom, CA +1 · Principal · Full-time · Posted Sep 15, 2026
- Location
- Folsom, CA
Richardson, TX - Experience
- 6+ years of semiconductor industry experience.
- Education
- BS, MS, or PhD or equivalent experience in Electrical Engineering, Computer Engineering, or related field.
About the job
Provides technology and design support for advanced HBM DRAM products, coordinating with foundries and internal teams to translate process capabilities into scalable architectures and improve product performance, power, reliability, and roadmaps.
What you'll do
- Serve as the technical interface between foundries and Micron design teams, closing design-process gaps and shaping technology requirements and roadmaps.
- Evaluate technology using circuit simulations, test chips, silicon validation, PDKs, and design-enablement methods.
- Implement AI-enabled workflows and automation to improve engineering productivity, decision-making, and execution efficiency.
What they ask for
- BS, MS, PhD, or equivalent experience in Electrical Engineering, Computer Engineering, or a related field.
- 6+ years of semiconductor industry experience and solid understanding of advanced semiconductor technology development.
- Strong grasp of advanced CMOS nodes, FinFET devices, and process integration.
- Hands-on experience with HSPICE simulations, device characterization, standard cell benchmarking, PPA analysis, parasitic extraction, and physical verification; experience driving AI-enabled engineering practices and automation.
Nice to have
- Direct experience with leading foundries such as TSMC, Samsung, Intel Foundry Services, or GlobalFoundries; memory products including DRAM, HBM, or SRAM.
- Knowledge of TSV technologies, advanced packaging, reliability modeling and aging simulations, advanced BEOL technologies, and PDK development and validation; experience with technology pathfinding or node selection.
Pay
$150,000.00 - $308,000.00 USD per year (base salary)
Tools
HSPICE, TSV, BEOL, FinFET, PDK, SPICE, DRAM, HBM
AI focus
Implement AI-enabled workflows and automation for engineering productivity, decision-making, and efficiency across DTCO, foundry interface, PDK evaluation, and design enablement; use AI tools to analyze and extract insights from technical documentation and data.
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