Micron
Principal HBM Architecture & Circuit Design Engineer
$139K–$308K
Richardson, TX +2 · Principal · Full-time · Posted Oct 27, 2026
- Location
- Richardson, TX
Folsom, CA
Boise, ID - Main Site - Experience
- No specific number of years stated.
About the job
Owns next-generation HBM core-die architecture and DRAM circuit design, from feasibility and reference designs through cross-functional execution and silicon bring-up.
What you'll do
- Define HBM core-die architecture and optimize bandwidth, power, area, thermal efficiency, and reliability.
- Design and evaluate DRAM circuits, timing, refresh, and reliability schemes using simulation and physical implementation analysis.
- Develop HBM Architecture Reference Designs and collaborate across teams through design execution, characterization, and handoff.
What they ask for
- Proven experience in DRAM architecture and circuit design (HBM, DDR, LPDDR, GDDR, or equivalent).
- Strong understanding of DRAM array architecture, row/column paths, sensing, datapath, refresh, and reliability mechanisms.
- Hands-on experience with SPICE-based circuit simulation tools (HSPICE, Spectre, FineSim, PrimeSim, or equivalent).
- Experience driving architecture decisions and cross-functional technical execution.
Pay
$139,000.00 - $308,000.00 USD a year (base salary)
Tools
HSPICE, Spectre, FineSim, PrimeSim, HBM, DDR, LPDDR, GDDR
AI focus
Supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making.
Model-written summary · the original posting is authoritative