Micron
Principal HBM Architecture & Circuit Design Engineer
$150K–$308K
Richardson, TX +1 · Principal · Full-time · Posted Oct 7, 2026
- Location
- Richardson, TX
Folsom, CA - Experience
- Not specified.
About the job
Owns next-generation HBM core-die architecture and DRAM circuit design, from feasibility and reference designs through cross-functional execution and silicon characterization.
What you'll do
- Define HBM core-die architecture and optimize bandwidth, power, area, thermal efficiency, and reliability.
- Design DRAM circuits and develop timing closure, refresh, row-hammer mitigation, and reliability schemes.
- Create HBM Architecture Reference Designs and support implementation, silicon bring-up, and failure analysis.
What they ask for
- Proven experience in DRAM architecture and circuit design (HBM, DDR, LPDDR, GDDR, or equivalent).
- Strong understanding of DRAM arrays, row/column paths, sensing, datapath, refresh, and reliability mechanisms.
- Hands-on experience with SPICE-based circuit simulation tools (HSPICE, Spectre, FineSim, PrimeSim, or equivalent).
- Experience evaluating design trade-offs and driving architecture decisions and cross-functional technical execution.
Pay
$150,000.00 - $308,000.00 a year (USD, base salary)
Tools
HBM, DDR, LPDDR, GDDR, HSPICE, Spectre, FineSim, PrimeSim
AI focus
Supports design and deployment of AI-enabled solutions to improve efficiency and decision-making.
Model-written summary · the original posting is authoritative