Micron
Principal HBM Design Architect
Richardson, TX · Principal · Full-time · Posted Jun 8, 2026
- Experience
- 7+ years with BSEE, or 5+ years with MSEE, in relevant circuit design.
- Education
- BSEE or MSEE.
About the job
Designs and analyzes DRAM circuits and future HBM architectures, supporting high-performance, low-power memory products using 3D stacking and TSV integration.
What you'll do
- Design, simulate, and optimize digital and analog DRAM circuits; evaluate block- and full-chip functionality.
- Analyze timing, area, power, complexity, PVT, and parasitic effects to support robust circuit operation.
- Conduct HBM architecture pathfinding and collaborate across engineering teams on development, layout, reviews, and methodology improvements.
What they ask for
- BSEE with 7+ years, or MSEE with 5+ years of relevant circuit design experience.
- Strong understanding of CMOS circuit design and device physics.
- Experience with schematic entry and simulation using HSPICE, FineSim, or equivalent; experience with power distribution and network analysis.
- Proficiency with scripting languages such as Python, Tcl, or Perl.
Nice to have
- Familiarity with DRAM, memory subsystem design, or high-speed interface circuits.
- Strong analytical and problem-solving skills; ability to communicate complex technical concepts across teams.
Tools
HSPICE, FineSim, Python, Tcl, Perl, CMOS, DRAM, TSV
Model-written summary · the original posting is authoritative