Micron
Principal HBM Design Architect
Richardson, TX · Principal · Full-time · Posted Jun 8, 2026
- Experience
- BSEE with 7+ years or MSEE with 5+ years of relevant engineering experience.
- Education
- BSEE or MSEE.
About the job
Designs, simulates, optimizes, and floorplans DRAM circuits and architectures for next-generation High Bandwidth Memory products.
What you'll do
- Design and optimize memory arrays, data paths, ECC, command/control logic, and high-speed interface circuits; assess functional correctness and design trade-offs.
- Conduct feasibility studies for future HBM architectures and support verification, debugging, and silicon validation.
- Collaborate on TSV-based 3D stacking and vertical integration, and contribute to design reviews and methodology improvements.
What they ask for
- BSEE with 7+ years or MSEE with 5+ years of relevant engineering experience.
- Strong knowledge of CMOS circuit design and semiconductor device physics.
- Experience with schematic entry and simulation using FineSim, HSPICE, or equivalent tools, and with power delivery and power network analysis.
- Proficiency in scripting languages such as Python, Tcl, or Perl.
Nice to have
- Familiarity with DRAM or memory subsystem design.
- Strong analytical, debugging, problem-solving, and communication skills.
Tools
FineSim, HSPICE, Python, Tcl, Perl
AI focus
Develops HBM solutions for AI and ML applications.
Model-written summary · the original posting is authoritative