Micron
Principal HBM Tapeout Execution & Release Coordination
Richardson, TX · Principal · Full-time · Posted Aug 11, 2026
- Experience
- 10+ years of relevant semiconductor industry experience preferred; no minimum years stated.
- Education
- Bachelor’s degree in Electrical Engineering or a related field, or equivalent experience.
About the job
Leads HBM tapeout execution and release coordination, ensuring design readiness, governance, and quality before release into Micron manufacturing.
What you'll do
- Manage HBM tapeout schedules, DBR achievements, release readiness, and governance.
- Prepare, review, and complete tapeout collateral, including TOAST, RCDB, TWIT, and release documentation.
- Coordinate signoff across technical teams and track database quality, risks, waivers, and open items.
What they ask for
- Bachelor’s degree in Electrical Engineering or a related field, or equivalent experience.
- Proven experience with SoC, memory, or semiconductor tapeout execution and design release processes.
- Strong knowledge of DBR processes, tapeout checklists, release governance, and signoff methodologies.
- Hands-on experience preparing or reviewing TOAST, RCDB, TWIT, or equivalent tapeout artifacts.
Nice to have
- 10+ years of relevant semiconductor industry experience.
- Experience coordinating cross-functional teams through tapeout; program/project management tools or methodologies; or Agentic AI tools for design and verification.
Tools
TOAST, RCDB, TWIT, Agentic AI
AI focus
Preferred experience using Agentic AI tools to assist with design and verification.
Model-written summary · the original posting is authoritative