Principal Process Engineer, Die Bonding

What you'll do

• Develop and resolve hybrid-bonding process technologies; coordinate process, equipment, and material evaluations and implement improvements.
• Lead yield-improvement and cost-reduction work; qualify and deploy new process baselines, tools, and materials for new products.
• Manage supplier quality and risk objectives, support process-control systems and audits, and drive technology deployment with internal teams and suppliers.

What they ask for

• BS degree and 8+ years of proven experience in Semiconductor Process Engineering.
• Solid engineering knowledge of semiconductor advanced packaging die-stacking processes.
• Skill in designing valid tests and Design of Experiments (DOE), with strong data collection, organization, and analysis skills.
• Knowledge of project management and experience leveraging AI to design experiments.

Nice to have

• Master's or Doctorate in Engineering, Physics, or a related field.
• 5+ years working on Die Bonding in Advanced Packaging settings, including Fusion Bonding, Hybrid Bonding, Direct Bonding, or applications such as MEMS, Imager, Memory, or Heterogeneous Integration; vendor, research institute, or equipment supplier/integrator bonding experience.

Tools

SPC, FDC, RMS, APC, Design of Experiments (DOE), Fusion Bonding, Hybrid Bonding, Direct Bonding

AI focus

Leverage AI to design experiments.