Micron
Principal Signal Integrity Engineer
Boise, ID - Main Site +1 · Principal · Full-time · Posted Sep 14, 2026
- Location
- Boise, ID - Main Site
Richardson, TX - Experience
- 10+ years of industry experience.
- Education
- MS or PhD in Electrical Engineering or related field.
About the job
Leads signal integrity pathfinding for high-speed memory and die-to-die interfaces, developing and validating interconnect models, channel solutions, design rules, and simulation-to-silicon methods.
What you'll do
- Generate and validate interconnect models using electromagnetic field solvers and time- and frequency-domain simulations.
- Evaluate substrate and packaging technologies, perform feasibility analysis and I/O-channel co-optimization, and develop design rules and link budgets.
- Collaborate across engineering teams and document analysis, modeling methods, and design specifications.
What they ask for
- MS or PhD in Electrical Engineering or a related field.
- 10+ years of industry experience in signal or power integrity analysis for high-speed interface technologies.
- Extensive electromagnetic and transmission line theory experience, plus time- and frequency-domain simulation and electromagnetic field solver experience.
- Working knowledge of oscilloscopes, TDR, and VNA for signal integrity characterization.
Nice to have
- Familiarity with memory I/O architectures, advanced packaging, post-silicon characterization, or optical link modeling.
- Willingness to learn and apply Artificial Intelligence-based methods to streamline modeling and simulation workflows.
Tools
ADS, HSPICE, SPECTRE, Q3D, SIWAVE, HFSS, TDR, VNA
AI focus
Preferred: learn and apply Artificial Intelligence-based methods to streamline modeling and simulation workflows.
Model-written summary · the original posting is authoritative