Micron
Principal Signal Integrity Engineer, Pathfinding
$119K–$320K
Boise, ID - Main Site +3 · Principal · Full-time · Posted Sep 22, 2026
- Location
- Boise, ID - Main Site
Folsom, CA
Richardson, TX
San Jose, CA - Experience
- 10+ years of industry experience in signal or power integrity analysis applied to high-speed interface technologies.
- Education
- MS or PhD in Electrical Engineering or related field; PhD preferred.
About the job
Develops and validates signal-integrity models and analyses for future high-speed memory and die-to-die interfaces, guiding packaging, channel, and design-rule decisions.
What you'll do
- Generate and validate interconnect models using field solvers and time- and frequency-domain simulations.
- Lead signal-integrity assessments of substrates and packaging, feasibility studies, and I/O/channel co-optimization.
- Define link budgets and design rules, develop sim-to-silicon correlation methods, and document findings for partner teams.
What they ask for
- MS or PhD in Electrical Engineering or a related field.
- 10+ years of industry experience in signal or power integrity analysis for high-speed interface technologies.
- Extensive electromagnetic and transmission-line theory experience, plus time- and frequency-domain simulation experience with ADS, HSPICE, SPECTRE, or equivalent.
- Deep electromagnetic field-solver experience (Q3D, SIWAVE, HFSS, or equivalent) and working knowledge of oscilloscopes, TDR, and VNA.
Nice to have
- Familiarity with memory I/O architectures, advanced packaging, post-silicon characterization, or optical-link modeling.
- Willingness to learn and apply Artificial Intelligence-based methods to streamline modeling and simulation workflows.
Pay
$119,000.00 - $320,000.00 USD a year (base salary)
Tools
ADS, HSPICE, SPECTRE, Q3D, SIWAVE, HFSS, TDR, VNA
AI focus
Preferred: learn and apply AI-based methods to streamline modeling and simulation workflows.
Model-written summary · the original posting is authoritative