Drimva

Micron

Process Integration Engineer, APTD

Boise, ID - Main Site · Full-time · Posted Sep 28, 2026

Experience
BS: 5+ years semiconductor experience; MS: 4+ years; PhD: 2+ years.
Education
BS, MS, or PhD in a related technical field; no equivalent-experience alternative stated.

About the job

Develops and integrates semiconductor process flows for next-generation memory and advanced packaging technologies, focusing on wafer-level technology and reconstructed substrates.

What you'll do

  • Lead integration projects and design experiments to evaluate process performance, variability, reliability, and yield.
  • Analyze testing and process data to resolve integration issues and help develop and qualify technologies across engineering and manufacturing teams.
  • Use AI tools for data analysis, experiment planning, documentation, and technical problem-solving.

What they ask for

  • Deliver technical results in process integration, process development, or device development, including experiment design, execution, and analysis.
  • Know semiconductor process integration and memory technologies such as DRAM, NAND, and/or emerging memory architectures.
  • Use data-driven methods such as statistical analysis, Design of Experiments (DoE), and root-cause analysis to solve technical problems.
  • Lead technical projects, collaborate across functions, communicate complex technical information, and use AI tools to improve technical workflows.

Nice to have

  • Experience with advanced packaging or Wafer-Level Technology/reconstituted wafer flows.
  • Experience transferring processes to high-volume manufacturing, reliability and test methodologies, or applying AI/machine learning to engineering workflows.

Tools

DRAM, NAND, Design of Experiments (DoE), AI, machine-learning

AI focus

Apply AI tools to data analysis, experiment planning, documentation, and technical problem-solving; preferred experience includes AI/machine-learning for engineering data analysis, anomaly detection, and yield improvement.

Model-written summary · the original posting is authoritative

First seen Oct 15, 2026 · Last verified Nov 4, 2026 (UTC)