Micron
Product Yield Enhancement Development Failure Analysis Engineer (High Bandwidth Memory)
Boise, ID - Main Site · Full-time · Posted Oct 21, 2026
- Experience
- 2+ years for each of the specified failure analysis and characterization areas; preferred: 5+ years in each area.
- Education
- Bachelor’s degree in Electrical Engineering, Computer Engineering, Physics, Materials Science, or a related field.
About the job
Analyze and resolve HBM semiconductor product failures to improve yield, reliability, and performance from development and qualification through production ramp.
What you'll do
- Perform electrical, physical, and statistical failure analysis and identify root causes of product defects.
- Use data analysis, statistical methods, and AI-enabled tools to improve failure detection, yield, and reliability.
- Collaborate across engineering teams to resolve fabrication, assembly, and test issues and communicate corrective actions.
What they ask for
- Bachelor’s degree in Electrical Engineering, Computer Engineering, Physics, Materials Science, or a related field.
- 2+ years of experience performing electrical and statistical failure analysis.
- 2+ years of experience applying electrical and physical characterization techniques for semiconductor failure analysis.
- Experience with AI, machine learning, or data analytics tools for engineering analysis and root cause investigations.
Nice to have
- 5+ years of semiconductor failure analysis and characterization experience.
- Experience with Generative AI tools or statistical analysis software such as JMP.
Tools
Copilot, Claude, JMP, Python, VLSI
AI focus
Use AI and analytics tools to support failure detection, failure prediction, root cause investigations, reliability learning, and yield improvement.
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