Micron
Senior Engineer, Advanced Packaging — Fail-Mode Metric Reaction (FMR)
Boise, ID - Main Site · Senior · Full-time · Posted Oct 16, 2026
- Experience
- 3–5 years of relevant industry experience.
- Education
- MS or PhD or equivalent experience in Electrical Engineering, Materials Science, Physics, or a closely aligned field.
About the job
Drives yield analysis, failure-mode investigation, and corrective-action reactions for advanced packaging products, reliability failures, and customer returns.
What you'll do
- Analyze yield and characterize defect signatures across advanced packaging test vehicles and production products; investigate root causes using electrical and physical failure-analysis findings.
- Lead reaction plans for reliability failures and customer RMAs, coordinating containment and corrective and preventive actions with process and product teams.
- Develop data pipelines, dashboards, and automated workflows; apply AI/ML to classify signatures, detect anomalies, and automate workflows.
What they ask for
- MS or PhD or equivalent experience in Electrical Engineering, Materials Science, Physics, or a closely aligned field.
- 3–5 years of relevant industry experience in advanced packaging, failure analysis, yield engineering, or a related semiconductor field.
- Hands-on experience with advanced packaging failure modes.
- Strong data analysis skills using Python, SQL, JMP, or equivalent; experience applying AI/ML and automation to engineering workflows; proven experience driving FA-to-fix loops.
Nice to have
- Familiarity with testing methodologies related to package failure modes and reliability stress methodologies such as HTOL, TC, and uHAST.
Tools
Python, SQL, JMP, AI/ML
AI focus
Applies AI/ML for failure-signature classification, anomaly detection, and workflow automation.
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