Drimva

Micron

Senior Engineer, OCT CPEE Central Mask Tape out

Boise, ID - North Office +1 · Senior · Full-time · Posted Oct 9, 2026

Location
Boise, ID - North Office
Boise, ID - ID1
Experience
5+ years in semiconductor manufacturing, mask operations, lithography, process engineering, or a related technical discipline.
Education
Bachelor’s degree in Engineering, Physics, Materials Science, or a related technical field.

About the job

Drives reticle quality and process improvement across Micron’s manufacturing sites, optimizing specifications, fracture and tapeout workflows, and operational performance.

What you'll do

  • Define reticle specifications and improve fracture, tapeout, and reticle preparation processes.
  • Resolve reticle, OPC, metrology, and process integration issues with cross-functional teams; evaluate tools and implement process optimizations.
  • Lead improvement initiatives and support adoption of best-known methods, automation, and AI-enabled workflows across sites.

What they ask for

  • Bachelor’s degree in Engineering, Physics, Materials Science, or a related technical field.
  • Strong understanding of reticle manufacturing, fracture techniques, CD metrology, and tapeout processes.
  • Experience leading technical projects and driving process improvements in manufacturing.
  • Excellent problem-solving, documentation, and communication skills; commitment to safety and continuous improvement.

Nice to have

  • Master’s degree in a related technical field.
  • Experience with reticle manufacturing, mask data preparation, OPC, fracture flows, tapeout, high-volume manufacturing, AI tools, workflow automation, or advanced analytics.

Tools

reticle, fracture, CD metrology, tapeout, OPC, AI-enabled tools, automation, advanced analytics

AI focus

Applies AI-enabled tools, automation, and intelligent workflows to improve productivity, project execution, and operational effectiveness.

Model-written summary · the original posting is authoritative

First seen Oct 15, 2026 · Last verified Nov 6, 2026 (UTC)