Micron
SMTS Process Engineer RDA /Metrology
Boise, ID - Main Site · Full-time · Posted Apr 21, 2026
- Experience
- 13+ years of semiconductor R&D experience, including 10+ years in advanced packaging.
- Education
- Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field.
About the job
Leads development and manufacturing scale-up of chip-to-wafer and hybrid bonding processes for 3D memory products.
What you'll do
- Set technical direction for bonding processes and develop process flows, materials, and integrations.
- Lead problem-solving across fabrication, die processing, bonding, thinning, and packaging.
- Transfer processes into manufacturing, partnering across teams to achieve repeatability and high-volume readiness.
What they ask for
- Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field.
- 13+ years of semiconductor R&D experience, including 10+ years in advanced packaging.
- Ability to lead multi-team technical efforts and drive decisions without formal authority.
Nice to have
- Experience leading FOAK process or equipment development and working with equipment and materials suppliers.
- Technical leadership through mentoring, methodology development, patents, or publications; expertise in bonding and package integration.
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