Micron
Sr. Engineer, CMP/Bond Equipment Development
Boise, ID - Main Site · Senior · Full-time · Posted Sep 29, 2026
- Experience
- 2 years of experience in the job offered or in a related occupation.
- Education
- Bachelor’s degree in Engineering Technology, Electrical Engineering, Materials Engineering, or related field.
About the job
Develops and improves CMP/Bond semiconductor equipment and processes to enhance fab performance, quality, yield, and throughput.
What you'll do
- Install, start up, and improve semiconductor processing equipment and identify alternative CMP/Bond hardware technologies.
- Lead technical development projects, analyze equipment and process results, and implement improvements to fab metrics.
- Resolve integration issues and standardize methods across areas, departments, or fabs; mentor engineers.
What they ask for
- Semiconductor process or equipment engineering experience.
- CMP/Bond equipment development, including Grind and Edge Trim, with understanding of CMP and Grind process-equipment interactions.
- Experience with design of experiments (DOE), defect analysis, and data analysis.
- Analytical and problem-solving skills, including JMP Pro 18, EMA, SPACE, and E3 software.
Tools
JMP Pro 18, EMA, SPACE, E3
Model-written summary · the original posting is authoritative