Drimva

Micron

Sr RDA Engineer, Advanced Packaging

Boise, ID - Main Site · Senior · Full-time · Posted Jun 18, 2026

Experience
4-6 years of semiconductor industry experience; at least 3 years of RDA experience. Preferred alternative: Master’s degree with 2+ years of industry experience.
Education
Bachelor’s Degree in Electrical Engineering, Chemical Engineering, Materials Science & Engineering, or related field; preferred Master’s Degree in EE, CE, MSE, or related field.

About the job

Analyzes semiconductor process defects and anomalies in advanced packaging, using inspection tools and data analysis to improve process control and accelerate technology development and transfer.

What you'll do

  • Analyze experimental process flows and inline signals, identify defect anomalies, and quarantine out-of-control tools.
  • Use inspection tools and strategies to detect problems earlier, investigate sources, and improve defect-detection methods.
  • Collaborate across teams and global sites to develop best-known methods and share process improvements.

What they ask for

  • Bachelor’s Degree in Electrical Engineering, Chemical Engineering, Materials Science & Engineering, or related field.
  • 4-6 years of semiconductor industry experience.
  • At least 3 years of RDA experience identifying and resolving defect integration issues.
  • Knowledge of semiconductor fabrication techniques and equipment concepts; basic data science/data manipulation skills.

Nice to have

  • Master’s Degree in EE, CE, MSE, or related field with 2+ years of industry experience.
  • Experience with metrology and inspection tools (SEM, X-ray, Laser or Optical Systems); technical writing and research experience.

Tools

SEM, X-ray, Laser, Optical Systems

AI focus

The role develops semiconductor processes and technologies that support next-generation products driving the AI revolution; no specific AI engineering work is described.

Model-written summary · the original posting is authoritative

First seen Oct 15, 2026 · Last verified Nov 4, 2026 (UTC)