Micron
Staff Engineer, APTD Backgrind/Edge Trim
Boise, ID - Main Site · Staff · Full-time · Posted Oct 8, 2026
- Experience
- Minimum 4 years; alternatively, preferred PhD in a related field with 2+ years of relevant industry experience.
- Education
- BS or MS degree; preferred PhD in a related field.
About the job
Develops and scales wafer edge trim, backgrind, and thinning processes for advanced packaging, improving performance, yield, cost, and wafer reliability.
What you'll do
- Develop and optimize wafer-processing processes, using data and equipment or consumable innovation to improve capability, yield, cost, and wafer integrity.
- Analyze wafer damage and process failures, identify root causes, and develop mitigation strategies; conduct early-stage research for ultra-thin wafer processing.
- Support process transfer and production ramp at manufacturing sites; limited domestic and/or international travel may be required.
What they ask for
- BS or MS degree and at least 4 years of relevant semiconductor-industry experience in wafer edge trim, backgrind, wafer thinning, CMP, or mechanical wafer processing.
- R&D experience advancing wafer-processing capability through structured experimentation.
- Expertise in experimental design (DOE), data analysis, and interpreting results to improve processes or technology.
- Strong analytical and problem-solving ability, with demonstrated success addressing complex process, yield, and reliability issues.
Nice to have
- PhD in a related field with 2+ years of relevant industry experience.
- Statistical analysis/SPC, advanced packaging exposure, or familiarity with Python scripting, automation, or GenAI-enabled analysis.
Tools
CMP, DOE, SPC, Python, MS Office
AI focus
Familiarity with GenAI-enabled analysis is preferred; the role focuses on wafer-processing R&D.
Model-written summary · the original posting is authoritative