Micron
Staff Engineer, APTD Backgrind/Edge Trim
Boise, ID - Main Site · Staff · Full-time · Posted Sep 8, 2026
- Experience
- Minimum 4 years; preferred alternative: PhD in a related field with 2+ years of relevant industry experience.
- Education
- BS or MS; preferred: PhD in a related field.
About the job
Develops and scales wafer edge trim, backgrind, and thinning processes for advanced packaging and memory products, from R&D through production ramp.
What you'll do
- Develop and optimize wafer-processing methods to meet product requirements and improve yield, cost, and wafer integrity.
- Investigate wafer damage and process failures, then develop mitigation strategies using experimentation and data analysis.
- Conduct early-stage research and support process transfer and production ramp at manufacturing sites.
What they ask for
- BS or MS degree and at least 4 years of relevant semiconductor-industry experience in wafer edge trim, backgrind, wafer thinning, CMP, or mechanical wafer processing.
- Hands-on R&D experience advancing wafer-processing capability through structured experimentation.
- Expertise in experimental design (DOE), data analysis, and interpretation.
- Ability to resolve complex process, yield, and reliability problems using root-cause analysis and first-principles understanding.
Nice to have
- PhD in a related field with 2+ years of relevant industry experience.
- Statistical analysis/SPC, advanced packaging exposure, or Python scripting, automation, or GenAI-enabled analysis.
Tools
DOE, MS Office, SPC, Python, GenAI
AI focus
Possible use of GenAI-enabled analysis as a preferred qualification; no other AI work is specified.
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