Micron
Staff Engineer, APTD Dry Etch
Boise, ID - Main Site · Staff · Full-time · Posted Jun 8, 2026
- Experience
- 5+ years with a related bachelor’s degree, or 3+ years with a related Master’s or PhD.
- Education
- Bachelor’s degree in Chemical, Mechanical, Electrical, Materials Science, Physics, Chemistry, Semiconductor Engineering, or related field; or Master’s or PhD in a related discipline.
About the job
Develop and scale plasma-based dry etch processes for next-generation advanced packaging, from R&D through high-volume manufacturing.
What you'll do
- Develop and optimize dry etch process modules for performance, yield, and reliability.
- Improve process capability, cost, and variability through experimentation and equipment innovation; investigate root causes and resolve process or hardware challenges with vendors.
- Collaborate across process teams and support global process transfers and manufacturing readiness, including occasional international travel.
What they ask for
- Bachelor’s degree in a related field and 5+ years of relevant dry etch experience, or a Master’s or PhD in a related discipline and 3+ years of relevant semiconductor dry etch experience.
- Hands-on R&D experience advancing process performance through structured experimentation.
- Ability to apply DOE, data analysis, and first-principles reasoning to complex process problems.
- Ability to work independently while managing multiple technical priorities and program commitments.
Nice to have
- Expertise in plasma etch and plasma–material interactions; experience influencing technology direction or process roadmaps.
- Exposure to advanced packaging technologies, statistical process control, Python, data automation, or GenAI-enabled analysis.
Tools
DOE, Python
AI focus
Develops and scales dry etch processes that enable packaging technologies central to the AI era; preferred familiarity with GenAI-enabled analysis for process development.
Model-written summary · the original posting is authoritative