Micron
Staff Engineer, HBM Test Vehicle Design
Richardson, TX · Staff · Full-time · Posted Sep 21, 2026
- Experience
- 5+ years of semiconductor experience in design, product engineering, packaging, technology development, or related subject areas.
- Education
- Master’s degree or PhD in Electrical Engineering, Computer Engineering, Materials Science, Physics, or related field.
About the job
Leads design and development of HBM test vehicles and characterization structures to generate technology learning, reduce risk, and inform future product decisions.
What you'll do
- Define test vehicle structures, specifications, measurement requirements, and validation objectives.
- Analyze silicon characterization and qualification results and recommend design or technology improvements.
- Lead investigations into design, process, and packaging interactions affecting performance, reliability, and manufacturability.
What they ask for
- Master’s degree or PhD in Electrical Engineering, Computer Engineering, Materials Science, Physics, or a related field.
- Strong understanding of semiconductor design and physical implementation fundamentals.
- Experience with silicon validation, characterization, data analysis, or failure investigation.
- Proficiency with demonstrating AI and AI-enabled development workflows.
Nice to have
- Experience with HBM, DRAM, or advanced memory products.
- Experience designing test structures, test chips, characterization vehicles, or technology demonstrators.
Tools
HBM, DRAM, TSVs, hybrid bonding, 3D integration
AI focus
Demonstrate AI and AI-enabled development workflows.
Model-written summary · the original posting is authoritative