Drimva

Micron

Staff Equipment Development Engineer, Advanced Packaging

Boise, ID - Main Site · Staff · Full-time · Posted Sep 28, 2026

Experience
2+ years of semiconductor process or equipment engineering experience; 2+ years of experience with DOE, SPC, defect analysis, and data analysis.
Education
Master’s Degree or equivalent experience in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or another related technical field.

About the job

Develops and optimizes next-generation wafer and die processing equipment for advanced packaging, from initial concepts through deployment in development and manufacturing facilities.

What you'll do

  • Build equipment maturity strategies and 5+ year hardware roadmaps; optimize equipment cost, availability, and capability.
  • Diagnose equipment and process limitations through root-cause and failure analysis, and lead development projects with equipment vendors.
  • Collaborate with process development teams, conduct equipment evaluations, and support equipment transfers to production facilities.

What they ask for

  • Master’s Degree or equivalent experience in a listed or related technical field.
  • 2+ years of semiconductor process or equipment engineering experience.
  • 2+ years of experience with design of experiment techniques (DOE), Statistical Process Control (SPC), defect analysis, and data analysis.
  • Hands-on experience with wafer / assembly tools and overlay systems; understanding of post-probe and assembly process/equipment interactions and related failures.

Nice to have

  • Ph. D. in a listed or related technical field, or equivalent experience.
  • Knowledge of robotics, machine logic language, or new hardware design; wafer or die bonding, plating, warpage control, or packaging experience.

Tools

DOE, SPC, FMEA, 8D, FDC/Data Science, overlay systems

AI focus

Requires using AI tools to streamline work processes, improve productivity, and enhance quality and creativity; the department develops AI-enabled technologies.

Model-written summary · the original posting is authoritative

First seen Oct 15, 2026 · Last verified Nov 5, 2026 (UTC)