Micron
Staff HIG ESD and Latch-up Engineer- HBM - TPG
$181K–$308K
Folsom, CA +1 · Staff · Full-time · Posted Sep 16, 2026
- Location
- Folsom, CA
Richardson, TX - Education
- Master’s degree or Ph.D. in Electrical Engineering or equivalent industry experience.
About the job
Own ESD and latch-up protection strategies and sign-off for HBM DRAM products, from design through silicon validation and high-volume manufacturing.
What you'll do
- Define chip- and IP-level ESD and latch-up strategies, requirements, targets, and sign-off criteria.
- Enable protection circuits and safe layout practices; lead silicon validation, failure analysis, and correlation with pre-silicon assumptions.
- Coordinate with foundries and design, packaging, reliability, and product teams.
What they ask for
- Master’s degree or Ph.D. in Electrical Engineering or equivalent industry experience.
- Strong fundamentals in ESD physics, latch-up mechanisms, and advanced CMOS devices.
- Hands-on experience with ESD protection circuits and latch-up prevention techniques.
- Familiarity with JEDEC and ESDA standards, including HBM, CDM, and JESD78.
Nice to have
- Experience supporting ESD and latch-up sign-off for advanced DRAM or HBM products; knowledge of SCR-based clamps, distributed ESD networks, and rail-based strategies.
- Experience with foundry ESD and latch-up teams; ability to mentor engineers and influence design methodology.
Pay
$181,000.00 - $308,000.00 a year (USD; base salary)
Tools
HBM DRAM, CMOS, JEDEC, ESDA, HBM, CDM, JESD78, SCR-based clamps
AI focus
Supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making; the team builds HBM solutions for AI and machine learning.
Model-written summary · the original posting is authoritative