Micron
Staff Process Engineer, Advanced Packaging CMP
Boise, ID - Main Site · Staff · Full-time · Posted Sep 25, 2026
- Experience
- 5+ years in semiconductor-industry CMP; preferred alternative: PhD in a listed field plus 3+ years of relevant experience.
- Education
- BS or MS in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, or Physics.
About the job
Develops and optimizes advanced packaging CMP processes to improve product quality, yield, cost, productivity, and manufacturing reliability.
What you'll do
- Develop and test CMP processes, consumables, and hardware for novel applications; run experiments to widen process margins and evaluate manufacturability.
- Implement advanced process monitoring and control, and diagnose manufacturing problems using failure analysis, FMEA, 8D, or SPC/FDC.
- Lead complex cross-functional improvement and innovation projects, including collaboration with vendors and contribution to patents or technical papers.
What they ask for
- BS or MS in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, or Physics.
- 5+ years of experience in Chemical Mechanical Planarization (CMP) within the semiconductor industry.
- Hands-on CMP equipment operation experience, including equipment, metrology, and polishing consumables listed in the posting.
- Experience in dielectrics/metals CMP process development and understanding of integration impacts and upstream/downstream process constraints.
Nice to have
- PhD in a listed field plus 3+ years of relevant experience.
- Data science or modelling skills, interest or experience using AI to optimize workflows, or a specialized background in 300mm wafer fabrication.
Tools
AMAT (LKP), EBARA-300X, optical metrology, profilometry, polishing slurries, conditioners, polishing pads, SPC/FDC
AI focus
Use AI to improve job functions; AI experience or interest is preferred for optimizing workflows.
Model-written summary · the original posting is authoritative