Micron
Staff Process Engineer, APTD Bonding
Boise, ID - Main Site · Staff · Full-time · Posted Aug 28, 2026
- Experience
- 5 years of relevant industry experience.
- Education
- BS in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, or Physics.
About the job
Develops and optimizes semiconductor bonding and packaging processes to improve product quality, reliability, yield, and productivity, while resolving manufacturing issues and supporting new product introductions.
What you'll do
- Develop and qualify process formulations, equipment requirements, and process baselines for new products.
- Diagnose and resolve assembly process problems using failure analysis, FMEA, 8D, or SPC/FDC methods.
- Coordinate process, equipment, and material evaluations; support process controls, portability, and supplier audits.
What they ask for
- BS in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, or Physics, plus relevant industry experience.
- Knowledge of Advanced Package Integration and DRAM, NAND, or other memory products.
- Experience with DOE, SPC, defect analysis, and data analysis.
- Semiconductor process engineering and packaging experience, including understanding of incoming and outgoing process and equipment interactions.
Nice to have
- MS or PHD in Materials Science, Chemical Engineering, Electrical Engineering, or Mechanical Engineering.
- Experience leading project teams or building supplier/vendor relationships.
Tools
DOE, SPC, FMEA, 8D, FDC, RMS, APC
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