Principal Package Engineer

What you'll do

• Select and drive packaging solutions, including chiplet-based 2.5D/3D designs, from definition through development and tapeout.
• Support silicon and package qualification, reliability, manufacturing bring-up, and quality across the product lifecycle.
• Assess and manage suppliers, develop FMEA, define EDA tool requirements, and collaborate with cross-functional engineering teams.

What they ask for

• Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field and 3+ years of technical engineering experience; or Master's degree in those fields and 6+ years; or Bachelor's degree in those fields and 8+ years; or equivalent experience.
• Ability to meet Microsoft, customer, and/or government security screening requirements, including the Microsoft Cloud Background Check.
• Provide citizenship, U.S. residency, or other protected-status documentation for assessment of access to export-controlled information; citizenship is verified with a valid passport, with other documents permitted for certain statuses.

Nice to have

• Preferred education and experience: Doctorate in Electrical Engineering, Physics, Computer Engineering, Computer Science, or related field and 5+ years; or Master's degree in those fields and 8+ years; or Bachelor's degree in those fields and 12+ years; or equivalent experience.
• 15+ years of hands-on semiconductor package experience; advanced packaging (e.g., BGA/2.5D/3D), supplier management, high-speed signaling, simulation, reliability, or failure analysis experience.

Pay

USD $142,800 - $274,800 per year (base salary); USD $188,000 - $304,200 per year (base salary)

Tools

2.5D/3D packaging, BGA, EDA tools, FMEA, thermo-mechanical FEA, OSAT