Microsoft
Principal Signal and Power Integrity Engineer
$143K–$304K
Raleigh, NC +4 · On-site · Principal · Full-time · Posted Jun 2, 2026
- Location
- Raleigh, NC
Austin, TX
Hillsboro, OR
Mountain View, CA
Redmond, WA - Experience
- Required: 3+ years with a doctorate, 6+ years with a master's degree, or 8+ years with a bachelor's degree in a stated or related field; equivalent experience also accepted. Preferred experience varies, including 7+ or 10 years in specified silicon, package, system, or power integrity areas.
- Education
- Doctorate, master's, or bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field; or equivalent experience.
About the job
Leads signal and power integrity design for compute and AI SoCs and platforms, developing and validating end-to-end power delivery solutions from silicon through package, platform, system, and cloud.
What you'll do
- Design, model, and simulate power integrity for data center processors and platforms, including DC, AC, transient, and link/electrical simulations.
- Develop power delivery solutions for high-performance computing and future chiplet architectures using advanced packaging and silicon nodes.
- Coordinate system design and architecture decisions with silicon, platform, package, motherboard, thermal, and power-performance teams.
What they ask for
- Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field and 3+ years of technical engineering experience; OR master’s degree in one of these fields and 6+ years; OR bachelor’s degree in one of these fields and 8+ years; OR equivalent experience.
- Ability to meet Microsoft, customer, and/or government security screening requirements, including passing the Microsoft Cloud Background Check.
- Provide proof of citizenship, U.S. residency, or other protected status for export-control eligibility assessment; citizenship is verified with a valid passport, with other documents accepted for some statuses.
Nice to have
- Experience with power integrity modeling for HPC products and advanced packaging technologies.
- Experience with foundry silicon, OSAT, and substrate technologies; knowledge of end-to-end system SIPI design and architecture.
Pay
USD $142,800 - $274,800 per year (base salary); USD $188,000 - $304,200 per year (base salary)
Tools
SoC, IP, DC, AC, OSAT
AI focus
Power integrity engineering for compute and AI SoCs and platforms.
Model-written summary · the original posting is authoritative