Senior Director, Board Product Development Engineering

What you'll do

• Establish end-to-end integration readiness processes, cross-domain sign-off gates, and manufacturing and test requirements.
• Build and lead a global Board PDE organization spanning PCB and fabrication, SMT/PCBA, and high-speed connectors and signal integrity.
• Own stack-wide reliability and yield, address root causes and design-for-excellence gaps, and collaborate with manufacturing partners.

What they ask for

• BS in Electrical Engineering, Materials Science, or a related technical field, or equivalent experience; MS or PhD is a plus.
• 15+ years in product, manufacturing, or operations engineering for high-complexity electronics; 8+ years leading engineering teams and 5+ years leading leaders in a global, cross-matrixed organization.
• Track record taking complex board and system products from design through NPI to high-volume manufacturing, with ownership of schedule, yield, and quality.
• Technical expertise in chip-to-board technologies, high-speed signal integrity, manufacturing testing, and supplier qualification; excellent executive communication and willingness to travel internationally (~20%).

Nice to have

• Full accountability for board manufacturing processes and yields on AI or datacenter platforms at hyperscale.
• Experience taking next-generation interconnect, packaging, materials, fabrication, or board manufacturing processes into high-volume manufacturing.

Pay

332,000 USD - 500,250 USD (base salary)

Tools

BERT, 112G/224G SerDes, fine-pitch BGA, 2.5D/3D packaging, PCB, SMT/PCBA, CTE, DFx

AI focus

The role develops AI/datacenter board products; NVIDIA uses AI tools in its recruiting processes.