Drimva

NVIDIA

Senior I/O Subsystem Architect

$224K–$431K

US, CA, Santa Clara · Senior · Full-time · Posted Jul 23, 2026

Experience
10+ years of relevant experience in some combination of architecture, design, and verification.
Education
MS or PhD in Electrical Engineering, Computer Science, or Computer Engineering (or equivalent experience).

About the job

Architects NVLink chip-to-chip interconnects and protocols, guiding requirements, design, integration, and delivery across the product lifecycle.

What you'll do

  • Research, model, validate, define, and document chip-to-chip communication architectures, balancing performance, area, power, security, and resiliency.
  • Define interfaces and system flows for NVLink C2C blocks and drive implementation with design, verification, firmware, and software teams.
  • Lead interconnect projects from concept through deployment, collaborating across engineering teams and evaluating technical trade-offs.

What they ask for

  • MS or PhD in Electrical Engineering, Computer Science, or Computer Engineering (or equivalent experience).
  • 10+ years of relevant experience in some combination of architecture, design, and verification.
  • Proven link-layer architecture experience covering Transaction layer, Data link layer, and Physical layer.
  • Experience with existing interconnects and knowledge of industry standard protocols CHI/CXL/AXI.

Pay

224,000 USD - 356,500 USD (base salary, Level 5); 272,000 USD - 431,250 USD (base salary, Level 6)

Tools

NVLink, NVLINK-C2C, PCIE, UCIE, CHI, CXL, AXI

Model-written summary · the original posting is authoritative

First seen Oct 16, 2026 · Last verified Nov 5, 2026 (UTC)