Drimva

NVIDIA

Senior Memory Post Silicon Qualification Engineer

$168K–$310K

US, CA, Santa Clara · Senior · Full-time · Posted Oct 1, 2026

Experience
10+ years in the semiconductor industry; at least 3 years directly on memory-interface bring-up, characterization, and qualification on shipped silicon.
Education
B.Tech or M.Tech in Electrical, Electronics, or Computer Engineering (or equivalent experience).

About the job

Own post-silicon bring-up, characterization, qualification, and root-cause resolution for high-speed memory on GPU, CPU, and SoC programs, while building AI-enabled qualification workflows.

What you'll do

  • Bring up and qualify GDDR, LPDDR, and HBM interfaces, including functional validation, IO tuning, and timing-margin analysis.
  • Lead cross-team root-cause investigations and deliver reusable workarounds and productized fixes.
  • Develop AI-enabled workflows for memory-data analysis, failure detection, and qualification decisions.

What they ask for

  • B.Tech or M.Tech in Electrical, Electronics, or Computer Engineering, or equivalent experience.
  • 10+ years in the semiconductor industry, including at least 3 years directly in memory-interface bring-up, characterization, and qualification on shipped silicon.
  • Deep protocol and physical-layer knowledge of GDDR, LPDDR, or HBM, with an example of root-causing and productizing a fix for an ambiguous memory failure.
  • Hands-on lab skills and working knowledge of PCB layout and SI/PI; demonstrated AI-driven workflow for memory characterization, margin analysis, or failure triage, adopted beyond personal use with measurable impact.

Nice to have

  • Experience creating reusable qualification methodology, debug playbooks, or margin-analysis frameworks adopted by other teams.
  • Team-deployed AI workflows such as agentic workflows, RAG-grounded debug assistants, automated shmoo analysis, or ML-driven margin prediction, with adoption metrics.

Pay

168,000 USD - 264,500 USD (base salary); 196,000 USD - 310,500 USD (base salary)

Tools

GDDR, LPDDR, HBM, oscilloscope, DMM, thermal chambers, protocol analyzers, PCB

AI focus

Build and deploy AI-enabled workflows for margin-data analysis, shmoo bucketing, failure-signature detection, workload-vs-margin correlation, and qualification decisions.

Model-written summary · the original posting is authoritative

First seen Oct 15, 2026 · Last verified Nov 4, 2026 (UTC)